50 mm Manual Probe System - For accurate and reliable DC/CV and RF measurements
The University Talent
The MPI TS50 manual probe system has been specifically designed for IC Engineering, Single Die probing and academic use in DC/CV and RF measurement applications. The TS50 with the smallest footprint (300 x 300 mm) on the market is engineered to its simplest form to allow convenient operation and providing quick set-up without compromising functionality and measurement capability.
The TS50 can be configured with two different versions of chuck stage control. The Easy Stage is very simple vacuum controlled, singe handed operated unit, which allows very fast and intuitive XY-Theta movement. This is the typical configuration for simple DC/CV applications.
20 mm Height Adjustment
The probe platen has 20 mm of fine height adjustment required to support various applications, and can be used for contact/separation control of all MicroPositioners together.
Linear 50×50 mm XY Stage
The linear 50×50 mm XY stage enables fast and independent axis movement with additional fine and accurate 25×25 mm XY-Theta micrometer positioning. The must option for RF or in combination with thermal chuck.
For RF applications, the TS50’s 50 mm triaxial chuck is installed with an auxiliary chuck built in ceramic material for accurate RF calibration.
Rectangular Adjustment of MicroPositioners
In addition, rectangular adjustment of the two port RF MicroPositioners is a standard feature to guarantee the alignment between the RF Probes.
Multiple Configurations of MicroPositioners
It can be configured with up to eight MPI MP25 or six MPI MP40 MicroPositioners for multiple pad and device layout requirements.
Various Optic Options
A wide range of Optics is available with a choice between stereo for all common DC/CV applications or single tube high magnification microscopes for RF or load-pull configurations.
An optional single IC holder transforms the TS50 into the ideal platform for single DUT testing down to 1×1 mm. It includes a stable and convenient vacuum switch to properly secure chip sizes as large as 10×10 mm. The incorporation of an integrated Calibration Substrate holder at a parallel height allows for RF measurements and can be mounted on any chuck including a variety of thermal chucks.