Designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
Designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testingzum Produkt
Reduced the size of a probe card to 28mmzum Produkt
Quietest cables in the Industry. Get the most out of your probe card.zum Produkt