MPI TS3000 Automated Wafer Probe System

The TS3000 from MPI is an automated 300 mm probe system, specifically designed for Product Engineering, Failure Analysis, Design Validation, Wafer Level Reliability and RF & mmW applications.


The TS3000 feature set provides:

  • Maximum on temperature range -60…300°C
  • Maximum on flexibility
  • Minimum cable distance to functional testers with a design specific cable interface for better measurement directivity
  • Minimum platen-to-chuck height for optimal mmW & internal node probing
  • Minimum system footprint which integrates the thermal system’s chiller “inside”




All of these features combined make the TS3000 probe station unique to MPI Corporation and to the product engineering market.


Incorporating MPI’s IceFreeEnvironment™ the TS3000 accommodates testing with MicroPositioners and / or probe cards over a wide temperature range of -60…300°C on up to 300 mm wafers with additional capability for probing on film-frames.


TS3000 provides large, easily accessible probe platen in order to accommodate up to 12x DC or 4x RF MicroPositioners with minimum of platen-to-chuck height. Integration of Load-Pull Tuners or larger area MicroPositioners makes TS3000 system an idea choice for RF and mmW measurements. The probe platen is actively cooled to avoid thermal drift especially at 300°C.


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