The system is designed to address Failure Analysis, Design Verification, IC Engineering, WLR as well as special requirements for MEMS, High Power, RF and mmW device testing on 200 mm wafer. Available for ambient and/or hot only temperature modes.
MPI exhibits at the Semicon 2017 in Munich.
This year's Semicon exhibition will be taking place at the Exhibition Ground Munich International from November 14th - 17th. How to Get to the Exhibition Ground Munich International.
MPI will be presenting at booth #B1-120.
The following products will be presented:
TS300-ShielDEnvironment™ (TS300-SE) is designed to ensure advanced EMI / RFI / light-tight shielding, ultra-low noise, low leakage measurement capabilities on 300 mm wafer in a temperature range from -60 to +300°C.
Together MPI and ERS designed the new 300 mm thermal chuck PRIME™ technology family - can be configured with lower temperature starting points of -60°C, -40°C, -10°C, 20°C or 30°C and at the higher end points at 200°C or 300°C.